摘要
低温共烧陶瓷(LTCC)技术通过近几年的发展,成为了无源元件集成的主流技术,随着其集成度的不断提高,对生瓷片的叠片精度要求越来越高,传统的手工销对位工艺已无法满足高精度的要求,本文叙述了一种自动对位的叠片工艺技术及未来的应用前景。
Low Temperature Co-fired Ceramic （LTCC） technology being developing from recent years now has becoming a mainstream technology on integrated passive components, which demanding on Health tiles with higher and higher lamination accuracy due to its continuing improvement on integration degree, and therefore the traditional Hand Pin alignment process has been unable to meet the requirements of precision, this paper describes the automatic alignment lamination process technology and its future applying prospect.
出处
《电子工业专用设备》
2010年第5期42-45,共4页
Equipment for Electronic Products Manufacturing
关键词
LTCC
生瓷片
叠片
无框工艺
LTCC Health tiles
Stacker
No frame Technology
