碳纳米管阵列应用于热界面材料的研究进展

Application of Carbon Nanotube Arrays as Thermal Interface Materials:The State of the Art

介绍与评价了近年来用于改善作为热界面材料(TIM)的碳纳米管阵列性能的方法,探讨了碳纳米管阵列形貌、缺陷状态、界面处理和固化材料引入对碳纳米管阵列导热性能的影响,总结了其在热界面材料领域应用所需要具备的条件,即能够作为热界面材料的碳纳米管阵列必须满足形貌合适、缺陷较少、一定程度复合、接触界面热阻低、封装工艺合理等一系列要求。

In this communication, the modification progress of carbon nanotube arrays （CNTA） as thermal interface materials（TIM） in high-power electronics is reviewed. In particular, the effects of array morphology, defect density, interracial features, and the introduction of adhesion on the thermal properties are discussed in details. As a promising TIM, carbon nanotube array should possess some exceptive requirements such as high quality, excellent mechanical performance, low interfacial thermal resistance and rational packaging techniques.