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电子信息行业用超硬材料切割工具综述 被引量:5

Summary of superabrasive cutting tools used in electronic information industry
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摘要 本文重点介绍了超硬材料切割工具在电子信息行业的应用现状,并阐述了电铸结合剂划片刀、金属及树脂结合剂高精度超薄超硬材料切割砂轮的制造工艺、使用性能、基本特点、型号、常用规格、粒度。同时探讨了我国电子信息行业用超硬材料切割工具的发展前景。 In this paper , the application status of the superabraive cutting tools are emphatically introduced. Manufacturing processes of the electroforming bond dicing blades , as well as the metal bonded and resin bonded grinding wheels are presented, their performances, basic features, and common specifications are also described. The development prospects of the superabrasive cutting tools used in electronic information industry are discussed.
作者 侯长红
出处 《金刚石与磨料磨具工程》 CAS 北大核心 2010年第1期60-62,共3页 Diamond & Abrasives Engineering
关键词 硅晶体 封装 光电子 划片刀 超薄 高精度 切割砂轮 silicon wafer packaging optoelectronics dicing blade ultrathin high precision cutting wheel
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