摘要
本文重点介绍了超硬材料切割工具在电子信息行业的应用现状,并阐述了电铸结合剂划片刀、金属及树脂结合剂高精度超薄超硬材料切割砂轮的制造工艺、使用性能、基本特点、型号、常用规格、粒度。同时探讨了我国电子信息行业用超硬材料切割工具的发展前景。
In this paper , the application status of the superabraive cutting tools are emphatically introduced. Manufacturing processes of the electroforming bond dicing blades , as well as the metal bonded and resin bonded grinding wheels are presented, their performances, basic features, and common specifications are also described. The development prospects of the superabrasive cutting tools used in electronic information industry are discussed.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2010年第1期60-62,共3页
Diamond & Abrasives Engineering
关键词
硅晶体
封装
光电子
划片刀
超薄
高精度
切割砂轮
silicon wafer
packaging
optoelectronics
dicing blade
ultrathin
high precision
cutting wheel