金刚石化学镀铜及还原处理研究

Investigation of electroless plating of copper on diamond and related deoxidization treatment

为改善金刚石和金属基体的润湿性,采用两种不同还原剂的配方在金刚石颗粒上进行化学镀铜,并在氢气气氛中对镀铜膜的金刚石进行还原处理。通过扫描电镜和X射线衍射仪研究了不同还原剂和不同还原温度对镀铜膜的微观形貌和成分的影响。结果表明:采用硼氢化钾比甲醛做还原剂化学镀铜效果好,用硼氢化钾做还原剂镀的铜膜晶粒为纳米微晶结构;在氢气氛中还原温度为300℃时氧化亚铜被还原成铜,在该温度下还原的铜膜表面平整均匀,晶粒无长大现象,对薄膜形貌影响较小;还原的镀铜金刚石呈紫红色,随还原温度的升高其外表由光亮逐渐变的暗淡,铜膜晶粒逐渐长大,薄膜的粗糙度也随之变大。

To improve the wetting behavior of diamond and metallic matrix,the electroless plating of copper on diamond particles was introduced using two formulations with different reducing agents,and the copper films of diamond were deoxidized at different temperatures in the atmosphere of hydrogen.The changes of structure and composition of copper films grown at different formulations and reduction temperatures were characterized by scanning electron microscopy（SEM） and X-ray diffraction（XRD）.The results show that the copper films obtained by application of potassium borohydride is mainly nano-crystalline and the film quality is better than that of formaldehyde.When the deoxidization temperature is 300 ℃,the cuprous oxide is reduced to copper.This temperature has little influence on the morphology of the film and there is no grain growth found.The surface of copper films keep smooth and uniform.With temperature increasing,the grain size and surface roughness of copper films increases gradually.Meanwhile,the colour of diamonds that copper films has been electroless plated becomes dim from original light purple.