钨铜复合材料的现状与发展

Current Status and Development of W-Cu Composite Materials

高导电导热性铜与高温强度、强抗电弧烧蚀钨的良好结合使钨铜复合材料具有一系列优异性能,广泛应用于电接触材料、电子封装和热沉材料。简要介绍了当前钨铜复合材料的应用、制备技术和致密化方法,阐述了钨铜复合材料的研究进展,指出了今后的应用发展前景。

The well combination of copper with preeminent conductivity and tungsten with high-temperature strength and arc-resistent leads a serial of preeminent properties. W-Cu composite materials are used widely as electric contracts, electronic seal and thermal materials. This paper briefly introduces the current application of W-Cu composite materials, preparation techniques and method of density. The research development and future development tendencies of W-Cu composite materials are also illustrated.