摘要
主要讨论了在焊膏印刷过程中三维检测方法对确保印刷质量的重要性,详细阐述了焊膏的印刷过程、检测点设置以及焊膏印刷三维检测等问题,三种三维检测方法及比较,提出以三维检测方法为基础的焊膏印刷工艺控制理念。
This article mainly discusses three-dimensional detection method for printing quality in solder paster printing process, describes solder paste printing process ,determine checkpoints, and three-dimensional inspection in solder paste printing. Technologies are introduced and compared.Process control method of solded paste printing based on three-dimensional inspection is suggested.
出处
《丝网印刷》
2010年第5期6-9,共4页
Screen Printing
关键词
焊膏
印刷
监测
工艺控制
solder paste
soreen printing
inspection
process control
