面积阵列封装——BGA和FlipChip

Area Array Package——BGA & Flip Chip

随着表面安装技术的迅速发展，新的封装技术不断出现，面积阵列封装技术成了现代封装的热门话题。ＢＧＡ和ＦｌｉｐＣｈｉｐ是面积阵列封装的两大类型，它们作为当今大规模集成电路的封装形式，引起了电子组装界的关注，而且逐渐在不同领域得到应用。ＢＧＡ和ＦｌｉｐＣｈｉｐ的出现，适应了表面安装技术的需要，解决了高密度、高性能、多功能及高Ｉ／Ｏ数应用的封装难题，预计随着进一步的发展，ＢＧＡ和ＦｌｉｐＣｈｉｐ技术将成为“最终的封装技术”。本文就ＢＧＡ和ＦｌｉｐＣｈｉｐ的结构、类型、应用及发展等诸多方面进行了阐述。

With the rapid development of surface mount technology,new packaging technologies arise continually and area array packaging technology becomes the issue of contemporary package.BGA and Flip Chip are the two main categories of area array package,as a package form of large scale integrated circuit,they gain the attention of electronic assembly industry,and have been used in some applications.With BGA and Flip Chip coming forward,they accommodate to the demand of surface mount technology,and resolve the applications with high density,high performance,multiple function and high I/O count,it is believed that with the further progress,BGA and Flip Chip should be the ultimate packaging technology.in this article,many things of BGA and Flip Chip,such as structure,type,application,development etc are described.