摘要
通过筛选试验,调整溶剂、松香和活化剂的含量,确定助焊剂中主要成分的最佳配比。根据国标GB/T9491—2002,测试助焊剂的扩展率、腐蚀性及其他性能,并根据日本工业标准JISZ3198—4—2003进行润湿力测试。结果表明:当助焊剂中有机酸活化剂质量分数为9%、m(水白松香):m(聚合松香)为2:3时,助焊剂具有良好的物理稳定性和润湿性,平均扩展率最高能达到76.00%。焊后铜片无腐蚀,残留物少且成透明膜状。
The contents of solvent,rosin and activator were adjusted to obtain the most appropriate proportion of the flux by a series of screening tests.The spreading rate,corrosivity and other performance of optimized fluxes were tested according to GB/T 949—2002.And the wetting force was tested with JIS Z 3198—4—2003.When the mass fraction of organic acid activator is 9% and the mass rate of two different rosins is 2：3,the flux shows good physical stability and wettability,and average spreading rate of the flux is up to 76.00%.There is no corrosion and less residue in the form of transparent membrane on the soldered Cu piece.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第3期38-41,共4页
Electronic Components And Materials
基金
国家"十一五"计划重点资助项目(No:2006BAE03B02)
2006年度高等学校博士学科点专项科研基金资助项目(No20060005006)
北京市高校"学术创新团队计划"资助项目
关键词
无铅焊膏
助焊剂
活化剂
扩展率
lead-free solder paste
flux
activator
spreading rate
