无铅银浆烧结工艺与导电性能研究

Investigation of sintering process and electrical conductivity of the lead-free Ag paste

制备了无铅低温玻璃粉,将其与银粉和有机载体混合配制成无铅导电银浆并烧结。通过SEM和EDX观察浆料烧结银膜的形貌并进行成分分析,用四探针测试仪测量烧结银膜的电阻率,讨论了浆料成分配比、烧结时间、烧结温度等方面对银膜导电性能的影响。确定了无铅导电银浆的最佳配比为:质量分数w(银粉)72%,w(玻璃粉)3%和w(有机载体)25%,最佳烧结温度为580℃,最佳保温时间为5min。

The lead-free low temperature glass powder was fabricated and lead-free conductive Ag paste was prepared and sintered by mixing the silver powder, the glass powder and the organic vehicle. The morphology of the paste sintered Ag film was observed by SEM, and ingredients, the resistivity were analyzed and measured by EDX, the four point probe meter, respectively. The effects of components of the paste, sintering time, sintering temperature on the conductive properties of Ag film were discussed. The optimal mass fractions of the silver powder, the glass powder and the organic vehicle in paste are 72%, 3% and 25%, respectively, and the optimal sintering temperature is 580 ℃ and the optimal holding temperature time is 5 min.