金属化布线晶片级测试系统

Wafer Level Test System of Wiring Metallization Electromigration

晶片级测试方法是半导体器件（ＶＬＳＩ）金属化可靠性试验中的一种新方法，本研究在现有设备的基础上进行了一系列的设计和改进，建立了一套由微机控制的晶片级金属化电徙动测试系统，为金属化可靠性测试和在线监测的研究奠定了良好的基础。

In this study,a new system for wafer level testing has been built,which will be used for electromigration experiment of metallization in semiconductor devices and VLSI.The system is controlled by a computer,which includes three parts:IEEE 488 devices,wafer testing form and temperature controller.The test program is compiled in visual basic.