助焊剂的研究及发展趋势

Investigation and development trends of fluxing agent for solder

在电子工业中,助焊剂是焊料的重要组成部分,并且对产品最终焊接性能影响很大。根据焊后的清洗工艺,助焊剂主要分为溶剂清洗型、水清洗型和免清洗型,该文分析这3种助焊剂的成分组成、使用情况以及优缺点。免清洗型助焊剂在焊后不需要清洗,具有环境友好,焊接生产周期短,成本低等优点,是最具发展潜力的助焊剂,国内外对免清洗助焊剂产品进行了大量研究,作者从溶剂、活性物质和添加剂等3个方面详细阐述免清洗型助焊剂配方的研究及发展趋势。

In the electronic industry field, fluxing agent is one of the most important constituent parts of solder and the weldability of products is greatly affected by the performances of the fluxing agent. According to the cleaning process after welding, the classification of fluxing agent is introduced which are solvent-clean, water-clean and no-clean fluxing agents. The compositions, using conditions, advantages and disadvantages of these three fluxing agent have been investigated. Since the No-clean fluxing agent needs not cleaning after welding, it has the advantages of environmentally friendly, short welding production cycle and low cost as well as be proposed as the most potential fluxing agent in the future. Lots of researches on no-clean fluxing agent are conducted both at home and abroad. In the present paper, the investigations of no-clean fluxing agent compositions and its development trends have also been described including solvent, activator and additives.