摘要
文章介绍了覆盖膜对柔软性的要求,采用一种高柔软性的环氧树脂制备了高柔软性的覆盖膜,同时对柔软性的量化方法进行了描述,并从高聚物粘弹性的本质分析了回弹力测试过程中的应力松弛现象。
The requirement on low stiffness of coverlay is introduced. One kind of low stiffness coverlay was prepared by low stiffness epoxy resin. Meanwhile the quantification method of low stiffness was explained, also stress relaxation phenomenon during the testing of resilience force was analysed based on the viscoelasticity of polymer.
出处
《印制电路信息》
2010年第6期59-60,70,共3页
Printed Circuit Information
关键词
高柔软性
覆盖膜
回弹力
应力松弛
Low stiffness
Coverlay
Resilience force
Stress relaxation
