半导体封装行业ERP与MES融合初探

Exploration of ERP and MES Integration in Semiconductor Industry

以半导体封装行业为例,从客户需求、过程管控、质量、成本等四个方面,探讨了ERP和MES融合的必要性;并且分析了融合要必备的条件,智能化和数字化程度高的加工设备、完备的产品身份标识、功能完备的ERP系统、资金的支持四个方面。提出了系统融合的架构和设想,通过对ERP和MES系统现状分析,得出ERP和MES系统的融合是大势所趋。最后预测封装企业由于加工设备具有数字化、智能化程度较高的优势,必将会走在系统融合的前列。

The semiconductor industry needs to take care of customer demand, process auditing, quality improving and cost reducing. The ERP and MES system are playing an important role in the above aspects. Due to the equipment＇ s intelligentization and digitalization, perfect identity, well-functioned ERP and capital support, integration system between ERP and MES is necessary. This paper analyzes the necessary conditions of system integration and predicts the popularity of system integration in semi-conductor industry.