大功率模块用新型冷板的传热性能研究

Heat Transfer Research on a Novel Cold Plate Used for High Power Electronics Module

提出了用于大功率模块冷却的新型冷板,该冷板的流道结构为S型且流道内置有分流片。首先对该新型冷板以及传统直线型流道和S型流道冷板的流场和温度场进行了仿真研究,对比了3种冷板的流动性能和换热性能。仿真结果表明,新型冷板具有较好的流动换热综合性能,在相同的进口流速和进口温度下,该冷板上芯片的最高温度比直线型冷板上芯片的温度低19℃,比S型冷板上芯片的温度低23℃。对其传热性能进行的实验测试验证了仿真结果。最后,通过仿真对新型冷板双面布置热源的情况进行的仿真研究结果表明,虽然双面布置热源时冷板上的热流密度加倍,但芯片的温度却只升高约20%,从而证明采用冷板散热能够成倍提高功率模块的集成密度。

A novel cold plate in which liquid passage is S-shape and fins are set in the passage is proposed.The temperature and flow fields of the novel cold plates are simulated and compared with that of the current linear cold plate and Sshape cold plate.The results indicate that the novel cold plate has the best flow and thermal performance among the three cold plates.The highest temperature of chips on it is 19 ℃ lower than that of the chip on the linear cold plate and 23 ℃ lower than that of chip on the S-shape cold plate under conditions of the same inlet velocity and the same temperature.The flow and thermal performance of the novel cold plate are also tested to verify the simulated results.Heat transfer performance of the novel cold plate with double-sided heat sources is simulated.The simulative results show that although heat flux of the cold plate with double-sided heat sources is twice of that in case of single-sided heat sources,the highest temperature of chips only increases 20%.