摘要
金丝键合是毫米波频段器件互连的主要手段,随着工作频率的不断升高,金丝的趋肤深度不断减小,金丝键合线对电路的影响也变得越来越大。通过对键合线模型的理论分析和软件仿真,总结出键合线的拱高、间隔等参数在EHF频段的影响规律。选择不同的补偿措施,尽量减小键合线带来的不良影响。通过对实物的测试,验证了以上结论。
Bond-wire is a key approach to interconnect devices on millimeter-wave band.With the higher operation frequency,the wire＇s depth of investigation decreases continually,and the skin effect of wire bond has a growing impact on the circuit.Based on theory analysis and software simulation of the wire bond model,the effect regulations of Bond-wire＇s parameters at EHF band on the circuitry and some referential conclusion are obtained.The adverse effect brought by wire bond is decreased by choosing different compensating methods.The practicality experiment results are accordant with simulation results.The results indicate that the methods discussed in this paper validity.
出处
《无线电工程》
2010年第6期57-61,共5页
Radio Engineering
