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PCB中基于DS-EBG结构的宽频带电源噪声抑制

The Suppression of Wide-band Power Supply Noise Based on DS-EBG Structures in PCB
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摘要 电磁能带隙(EBG)结构能有效解决高频电源完整性问题,但不利于PCB的微型化设计。文章将三维立体封装中使用的双层EBG(DS-EBG)结构应用到PCB电源完整性设计中。通过理论分析证明了它的宽频带电源噪声抑制性能,并利用Ansoft公司SIwave软件进行仿真,成功对理论分析进行了验证。 The structure of the electromagnetic bandgap can effectively solve the problem of power integrity at high frequency.But this structure is not propitious to the subminiature design of PCBs.In this article,the DS-EBG structures which have been used in 3-D package are used in the power integrity design of PCBs.It is proved by theory analysis that this structure has a significantly extended noise isolation bandwidth,which is validated using the software of SIwave from Ansoft Corporation.
作者 李瑾 田志勇 卢远程
机构地区 西安电子科技大学机电工程学院
出处 《电子质量》 2010年第6期78-80,共3页 Electronics Quality
关键词 DS-EBG 宽带噪声抑制 SIwave DS-EBG significantly extended noise isolation bandwidth SIwave
分类号 TN41 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献7

  • 1阿鸣.电源完整性理论基础[Z].
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  • 7Ansoft_SIwave _full_ book. Ansoft Corporation[Z].

二级参考文献7

  • 1.Allegro PCB Layout System[]..
  • 2L.Smith.Packaging and Power Distribution DesignConsiderations for Sun Microsystems Desktop Work-station[].IEEE th Topical Meeting on ElectricalPerformance of Electronic Packaging.1997
  • 3Y Rahmat-Samii,H Mosallaei.ElectromagneticBand-gap Structures:Classification,Characterizationand Applications[].th International Conferenceon Antenna and Propagation.2001
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  • 6.Power Integrity and Ground Bounce Simulation of High Speed PCBs[].AnsoftEmpowering Profitability worldwide workshop.2002
  • 7Steve C. Cripps.Advanced Techniques in RF Power Amplifier Design[]..2002
电子质量
2010年 第6期

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