光路可调的红外透射方法检测键合质量

Test of bonding quality by means of adjustable infrared transmission

基于红外透射原理,采用调节光路的冷光源方法搭建了晶片键合界面的质量检测系统。利用该系统可以很好的实现GaAs,InP材料的键合界面检测和刀片分离时的在线监测,同时本文以GaAs基分布布拉格反射镜(DBR)和InP基有源区键合为例,结合红外透视图像和薄膜转移照片分析,对键合表面处理方法进行了优化选择。试验表明该检测系统数据可靠,使用方便,为晶片键合条件及参数优化提供了实用平台。

Based on Infrared transmission theory, quality test system for wafer bonded interface was set up using optical method with cold light source. With this system, quality of bonded interface for materials of GaAs and InP could be judged. This system also offered a real-time inspection for the blade insertion test. Meanwhile, optimal surface treatment method is selected by infrared transmission and film transferring pictures for bonding of GaAs-based distributed Bragg reflector （DBR） and InP-based active region. The infrared transmission system is believed to be an excellent platform for judgment and select of bonded sample, effectively decreasing experimental period and cost. It also offers reliable experiment data for optimization and analysis of wafer bonding parameters.