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工艺变化下互连线建模与ABCD参数仿真

Modeling of Interconnects and Simulation of ABCD Parameters in Presence of Process Variations
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摘要 考虑互连线工艺变化的空间相关性,采用数值仿真及拟合方法,得到电气分布参数的近似表达式,建立了互连线分布参数随机模型;推导出互连线ABCD参数满足的随机微分方程组,并提出基于蒙特卡洛法的ABCD参数统计分析方法;最后,通过对ABCD参数各参量系数的正态性进行偏度-峰度检验,给出最差情况估计。实验结果表明,提出的互连线随机模型及统计分析方法可以对工艺变化下的互连线传输性能进行有效的评估。 Considering the spactial correlation of interconnect process variations,approximate expressions of electrical parameters were obtained by numerical simulation and fitting,and stochastic interconnect model with distributed parameters was proposed in the presence of process variations.Stochastic differential equation of ABCD parameters was derived and statistical analysis method for ABCD parameters based on Monte Carlo method was presented.Finally,Jarque-Bera test was made for normality and worst-case estimation was given.Experimental results demonstrated that the proposed stochastic model and the statistical analysis method were effective for evaluating transmission performance of interconnects in the presence of process variations.
出处 《微电子学》 CAS CSCD 北大核心 2010年第3期416-420,共5页 Microelectronics
基金 南京邮电大学引进人才科研启动基金资助项目(NY207025)
关键词 互连线 工艺变化 随机微分方程 蒙特卡洛法 Interconnect Process variation Stochastic differential equation Monte Carlo method
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