芯片凸点电镀中的清洁生产技术

Cleaner Production Technology in Chip Bump Electroplating

清洁生产技术越来越受到重视,我国已经将推进清洁生产提到法律的高度。通过在芯片凸点电镀过程中优选电镀液配方及施镀方式,采用等离子清洗技术,优化阴极夹具,改善镀层厚度均匀性等措施,达到提高资源利用率,减少污染物的产生,减轻对人和环境危害的目的。

Cleaner production technology is becoming more and more important,and regulations were made to promote cleaner production.By choosing proper recipe for eletrobath and electroplating method for chip bump electroplating,using plasma cleaning,optimizing cathode clamp and improving uniformity of plating thickness,resource can be utilized more efficiently,and environmental contamination and damage can be minimized.