摘要
大功率白光LED使半导体照明走进千家万户成为了可能。针对目前行业无统一标准的现状,各企业和科研机构都通过申请专利来保护自己的技术,该文结合现有专利的申请情况,阐述了大功率白光LED的荧光粉涂覆技术、散热技术以及多晶片封装技术等方面的专利现状,并在此基础上提出了下一阶段大功率LED封装可能的发展方向。
Because of having no uniform standard for SSL industry, all corporations and research organizations protect their technologies by applying for patent. In this paper, the technologies of phosphor-coating, disperse-heat, packaging of multi-chip and so on were expounded, then, the possible development of power LED packaging was advanced.
出处
《灯与照明》
2010年第2期37-39,共3页
Light & Lighting
