摘要
焦平面技术在红外侦察系统和红外成像导弹系统等军事领域都已经进入实际应用阶段,同时还将扩展到诸如工业监控测温、医疗卫生、海上救援、车辆和舰船的驾驶员夜视增强观察仪等广阔的民用领域。红外焦平面阵列是红外成像的核心部件,对于红外焦平面铟柱的连结方式目前主要是通过倒装焊的封装方式,通过涂敷助焊剂并通过红外回流将其重要组成部分的探测器和读出电路互连起来。文章主要介绍了应用于红外焦平面铟柱互连的倒装焊封装技术及其可靠性的影响。
Infrared focal-plane technology already in application to many field.such as infrared reconnaissance system and infrared image formation missile system etc.Meanwhile had expand to many civil field.such as the industry monitoring for temperature watch,the health,the rescue on the sea,the night vision enhancement visualizer for vehicles and ships＇ pilot etc.The infrared focal-plane array is the core part of infrared image formation,Flipchip is the main mode for infrared focal-plane indium column＇s linked at present.Through screen print flux and reflow to connect the detector and reading circuit＇s.This paper mainly discussed the flipchip technology in application to the infrared focal-plane indium column connection and the influence to reliability.
出处
《电子与封装》
2010年第6期6-7,11,共3页
Electronics & Packaging
关键词
红外焦平面
铟柱互连
封装
倒装焊
infrared focal-plane
In connected
assembly
flipchip
