摘要
分析了照明用大功率LED封装的散热特性,提出了一种用于大功率LED系统散热的回路热管;研究了热负荷、倾角、加热方式等对热管的起动性、均温性、热阻等的影响。试验结果表明,所设计的热管散热器的热阻在0.19K/W^3.1K/W之间,蒸发器的均温性被控制在1.5℃以内,满足大功率LED封装的均温性要求,在热负荷为100W时,蒸发器的温度被控制在100℃以下,满足大功率LED结点温度的控制要求。
The heat - release characteristics of high power LED package applied to lighting were analyzed and a novel flat evaporator loop heat pipe cooling device for high power LED was developed;The influences of heat loads, inclining angles and heating ways on the startup performance, temperature uniformity and thermal resistance of loop heat pipe were studied experimentally. The results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19K/W - 3.1K/W, the temperature uniformity in the evaporator is controlled within 1.5K, and the junction temperature of high power LED can be controlled steadily under 100℃ for the heat load of 100W. The loop heat pipe studied in this paper can effectively meet the requirement of the thermal management of high power LED, and shall be very promising heat - transfer devices for controlling junction temperature Of high power LED system.
出处
《低温与超导》
CAS
CSCD
北大核心
2010年第6期61-65,共5页
Cryogenics and Superconductivity
基金
国家自然科学基金资助项目(50676063)
"建筑能效控制与评估"教育部工程研究中心开放课题基金项目(KF2009.07)
安徽省教育厅基金项目(KJ2010B042)
安徽建筑工业学院硕博启动基金项目资助
关键词
大功率LED
回路热管
热阻
平板式蒸发器
结温
High power LED, Loop heat pipe, Thermal resistance, Flat evaporator, Junction temperature