表面活性剂对Cu-nanoAl_2O_3复合电镀的影响

Effects of Surfactants on Cu-nanoAl_2O_3 Composite Plating

以酸性硫酸盐镀铜液为母液,在一定的工艺条件下复合电沉积Cu-nanoAl2O3复合镀层,选用3种典型的表面活性剂对纳米颗粒进行分散,即阳离子性表面活性剂(十六烷基三甲基溴化铵CTAB),阴离子性表面活性剂(十二烷基苯磺酸钠LAS)和非离子性表面活性剂(聚乙二醇PEG6000),通过对比试验研究了它们对复合镀层的影响。结果表明,CTAB能有效提高nanoAl2O3的悬浮性,促进纳米颗粒与金属铜的共沉积;LAS能改善镀层的表面质量,但对纳米颗粒的复合量作用不大。

compounded Cu-nanoAl2O3 composite plating by using acidic copper sulphate as solvent under the condition of some process,chose the three typical surfactants,or cationic hexadecyl trimethyl ammonium bromide,cetrimonium bromide（CTAB）,anionic linear alkylbenzenesulfonate（LAS） and non ionic polyethylene glycol（avg mol wt 6000PEG6000）.It can be concluded that plating with CTAB increased the suspension of Cu-nanoAl2O3 and enhanced the binding of the nanometer partical and Cu-nanoAl2O3;while LAS improved the condition of the plated surface,it does not have any effects on the molecular level binding of the Cu-nanoAl2O3 molecules.