摘要
利用氧化增重实验对纯铜的表面氧化性进行研究,分析纯铜的组织和纯度对其氧化性能的影响。结果表明:单晶组织铜氧化速率与晶粒取向有关,单晶铜(100)晶面的氧化速率大于(111)晶面的氧化速率;多晶铜的氧化速率处于单晶铜(100)晶面与(111)晶面氧化速率之间。纯铜的氧化速率与杂质原子类型和温度有关,纯度越高纯铜氧化速率越小。
The surface oxidation of copper is studied by using the oxidation live weight gain experiment. The impact of the structure and purity of copper on its oxidation rate is analysed. The results showed that： The oxidation rate of single crystal copper relate to the grain orientation. The oxidation rate of single crystal copper with grain orientation of （100） crystal face is greater than that of （111 ） crystal face. The oxidation rate of polycrystalline copper is between the single crystal copper oxidation rate of （100） crystal face and （111） crystal face. The oxidation rate of pure copper is related with the type of impurity atoms and the temperature. The higher purity, the stronger antioxidation of copper.
出处
《铸造技术》
CAS
北大核心
2010年第6期723-726,共4页
Foundry Technology
基金
兰州市科技局计划资助项目(2009-1-9)
关键词
单晶铜
多晶铜
纯度
氧化速率
Single-crystal copper
Polycrystalline copper
Purity
Oxidation rate
