摘要
SiO2介孔薄膜具有优良的绝热性能,在热学、光学、微电子等领域有广阔的应用前景,其介孔结构对降低薄膜的热导率有着十分重要的作用,对介孔薄膜热导率的计算模型及测量方法的研究仍在不断探索中。对SiO2介孔膜的隔热机理进行了概述,从理论方面综述了对热导率研究的一些基本方法,并对薄膜热传导的尺寸效应作了说明。
SiO2 mesoporous films have excellent thermal insulation performance.It has broad application prospects in calorifics,optics,microelectronics and other fields.The mesoporous structure is very important in reducing thermal conductivity of film.The calculation models and mensuration methods of mesoporous film thermal conductivity are still being explored.Thermal insulation mechanism of SiO2 mesoporous film is described in this paper.Some methods of the film thermal conductivity studies are summarized from theoretical.And also the scale effect of thermal conductivity is explained.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2010年第6期927-930,共4页
Journal of Functional Materials
基金
云南省应用基础研究计划重点资助项目(2006E0001Z)
云南省应用基础研究面上资助项目(2008CD076)
关键词
SiO2介孔薄膜
隔热
微尺度传热
热导率
SiO2 mesoporous film
thermal insulation
microscale
thermal conductivity
