期刊文献+

电解铜工艺的节能措施及效果 被引量:4

Energy Saving Measurements and Effects in Electrolytic Copper Smelting
下载PDF
导出
摘要 某公司原有电解铜系统由于设计起点低,工艺落后,生产处于被动状态,尤其是能耗指标一直高于同行业水平,不符合国家关于有色行业的节能减排目标要求,为此,该公司对铜电解系统进行了改造,采用了节能工艺及一系列的节能措施,取得了非常理想的效果。 In a Copper Smelting,the process of electrolytic copper was designed in the low starting point and backward technology,the production in a passive state.In particular energy consumption index has been higher than the industry standard,does not meet the objectives and requirements of the saving energy and reducing emissions of national on the non-ferrous industry.The company's copper electrolysis system was rebuilt.The energy-saving process and a series of energy-saving measures were adopted and achieved satisfactory effects.
作者 张杰
出处 《有色矿冶》 2010年第3期95-96,共2页 Non-Ferrous Mining and Metallurgy
关键词 能耗 电解铜 节能 energy consumption electrolytic copper energy saving
  • 相关文献

参考文献3

二级参考文献1

  • 1李庆芬.关于调整我国铜电解电流密度的意见——经济电流密度计算模型[J]有色金属(冶炼部分),1981(02).

共引文献12

同被引文献35

  • 1李春棠.铜电解车间的节能设计与实践[J].中国金属通报,2008,0(13):27-28. 被引量:1
  • 2胡渊明,马春来.降低铜电解直流电耗的生产实践[J].有色矿冶,2006,22(4):61-63. 被引量:9
  • 3李茂,周孑民,王长宏.300 kA铝电解槽电、磁、流多物理场耦合仿真[J].过程工程学报,2007,7(2):354-359. 被引量:24
  • 4李宝文.侯马冶炼厂50kt/a铜电解设计与生产实践[J].铜业工程,2007(1):40-42. 被引量:4
  • 5有色金属提取冶金手册编委会.有色金属提取冶金手册(铜镍卷)[M].北京:冶金工业出版社,2000.
  • 6POHJORANTA A, MENDELSON A, TENNO R. A copper electrolysis cell model including effects of the ohmic potential loss in the cell[J]. Electrochimica Acta, 2010, 55: 1001-1012.
  • 7KONIG J, MUHLENHOFFB S. Velocity measurements inside the concentration boundary layer during copper-magneto- electrolysis using a novel laser Doppler profile sensor[J]. Electrochimica Acta, 2011, 56:6150-6156.
  • 8KAWAI S, MIYAZAWA T. CFD modelling and simulation of industrial-scale copper electrorefining process[J]. Minerals Engineering, 2014, 63:81-90.
  • 9Transient mass transfer rate of Cu2~ ion caused by copper electrodeposition with alternating electrolytic current[J]. Electroehimica Acta, 2010, 55: 3987-3994.
  • 10Two- and three-dimensional numerical modeling of copper electroplating for advanced ULSI metallization[J]. Solid-State Electronics, 2000, 44: 797-807.

引证文献4

二级引证文献37

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部