摘要
A CO2 laser die-cutting system, which does not need die board any more, is a new technique for manufac-turing packing box. Two optical paths, the galvanometer scanning system and the flying optical system, are used to satisfy different processing needs. The scanning system is composed of galvanometer scanning mirrors and F-θ lens. And the flying optical system is driven by two servo motors. This paper presents the software and hardware design of the laser die-cutting system, the difference between the two optical paths, as well as the relationship among the cutting speed, thickness of wrapping paper and laser power. The cutting speed and thickness of wrapping paper are linearly increased by the incremental laser power, while the cutting speed is hyperbolically decreased by the incremental thickness of wrapping paper when the laser power is constant. The amount of incision is reduced by 20% and the processing time by 40% when tested by a low power RF CO2 laser die-cutting system using the optimized program. This tech- nique is also used for the reference of other rapid laser processing systems.
A CO2 laser die-cutting system, which does not need die board any more, is a new technique for manufacturing packing box. Two optical paths, the galvanometer scanning system and the flying optical system, are used to satisfy different processing needs. The scanning system is composed of galvanometer scanning mirrors and F-θ lens. And the flying optical system is driven by two servo motors. This paper presents the software and hardware design of the laser die-cutting system, the difference between the two optical paths, as well as the relationship among the cutting speed, thickness of wrapping paper and laser power. The cutting speed and thickness of wrapping paper are linearly increased by the incremental laser power, while the cutting speed is hyperbolically decreased by the incremental thickness of wrapping paper when the laser power is constant. The amount of incision is reduced by 20% and the processing time by 40% when tested by a low power RF CO2 laser die-cutting system using the optimized program. This technique is also used for the reference of other rapid laser processing systems.
基金
Supported by by Major State Basic Research Development Program of China ("973" Program, No. 2010CB327800)
