摘要
电子装联技术在印制电路板中应用广泛。在电子装联技术中,焊膏印刷的效果对产品质量关系极大。文章主要探讨焊膏印刷过程中操作技术要点和应注意的问题,以及一些常见故障的处理方法。
The surface mounted technology is applied in the printed circuit board extensively. In the surface mounting technology, the result of the solder printing is very big to the product quantity. This paper discusses the solder printing process technological key points and the common breakdown problem solution.
出处
《印制电路信息》
2010年第7期60-65,共6页
Printed Circuit Information
关键词
电子装联
印制线路板
焊膏
印刷技术
surface mounting technology
printed circuit board
solder
printing technique
