摘要
以二烷氧基硅烷和三烷氧基硅烷单体,选择烃基与硅原子比值(R/Si)为1～1.2,用间歇缩聚工艺合成的硅树脂胶粘剂,经红外光谱、TGA和力学性能分析,结果表明,研制的胶粘剂具有耐热性好、分解物少的特点,性能与日本信越化学公司的KR-242A相当。
A type of silicone resin adhesive was synthesized by a batch polycondensation, with dialkoxylsilane and trialkoxysilane as monomers and the ratio of R/Si as 1 to 1.2. The product was analyzed by FTIR, TGA and research on the mechanical properties. The results indicate that the adhesive has high heat resistance and little resolvent property and can compare with KR-242A to a certain degree.
出处
《绝缘材料》
CAS
北大核心
2010年第3期8-11,共4页
Insulating Materials
关键词
胶粘剂
有机硅
耐热
R/Si比
云母板
adhesive
organosilicon
high-temperature resistance
ratio of Si/R
mica plate
