单晶硅二维超声振动辅助磨削技术的实现

Development of a Two-dimensional Ultrasonic Vibration Assisted Grinding Technique of Monocrystal Silicon

基于超声振动磨削能有效提高加工效率及加工表面质量的特性,通过设计具有伸缩和弯曲两种模态的压电陶瓷椭圆振子,实现了单晶硅二维椭圆振动磨削技术。对超声振子的振动特性进行检测,证实改变压电陶瓷两电极之间的交流信号相位差和电压幅值,可得到不同形状和振幅的椭圆振动。对单晶硅进行超声磨削与普通磨削的对比试验,结果表明二维振动磨削的磨削力大幅降低,表面粗糙度显著减小,表面质量明显提高,加工表面延性域去除比例增加。从而证实二维超声振动磨削方法能够实现高效率高质量单晶硅加工。

Based on the characteristics of higher machining efficiency and higher surface quality of ultrasonic vibration grinding,a two-dimensional ultrasonic vibration grinding of monocrystal silicon technique is achieved by designing elliptical vibrator with longitudinal mode and bending mode.The measurement results on the vibration characteristics of vibrator show that shape and amplitude of elliptical vibration can be modulated by changing voltage amplitude and phase difference between the piezoelectric ceramics electrodes.The grinding experimental results show that under the elliptic ultrasonic vibration assistance,grinding forces are reduced largely,the surface roughness is decreased significantly,the surface quality is improved obviously,and moreover the percentage of ductile-mode removal material increases.These indicate that high efficiency and high surface quality machining of monocrystal silicon can be achieved with elliptic vibration assisted grinding.