摘要
针对Sn58Bi焊料脆性高、成型难问题,通过Sb掺杂结合快冷工艺对Sn58Bi合金性能进行了优化。对合金的显微组织、熔化特性和拉伸力学性能的研究表明,Sn58Bi焊料组织粗大、偏析相多,适量Sb元素掺杂和快冷处理能够细化组织,将其断后伸长率提高7%以上,同时对合金熔化特性影响不大。断口分析表明,Sn58Bi合金以脆性断裂为主,加入适量Sb元素时,延性断裂趋势增加,但加入Sb过量时,又向解理断裂转化。
The Sn58Bi eutectic alloy is brittle and hard to be shaped by extruding, so stibium doping and rapid cooling process were adopted to optimize the performance of Sn58Bi alloy. Microstructure, fusion and tensile behaviors of alloys with and without Sb doping were studied. The results show that Sn58Bi has coarse structure and segregation phases. The Sb doping and rapid cooling process can refine the structure of the alloy, increase the elongation rate and have little influence on the melting behavior. The analysis on the fracture appearance shows that the rupture mode of the alloy is mainly brittle fracture. The addition of Sb element can make the rupture tend change to ductile fracture. However, over-adding of Sb will result in cleavage fracture.
出处
《焊接》
北大核心
2010年第6期31-34,共4页
Welding & Joining
基金
广州有色金属研究院科技创新基金"低温丝状锡铋系焊料及助焊剂的研究与应用"资助(1683010)
关键词
无铅焊料
锡铋
元素掺杂
电子元器件
lead-free solder
SnBi
element doping
electronic components
