急热时裂纹的应力加强因子——用半级条纹光弹分析法

Determining the Stress Intensity Factors under Thermal Shock by Using Half-Fringe Photoelasticity

一条非常靠近边界而且平行于边界的裂纹,在光弹应力分析中,使用了半级条纹光弹分析法,配以计算机控制的图象数值分析系统来确定急热时它的瞬态应力加强因子.提出了应力加强因子随时间变化的实验结果.

In photoelastic stress analysis the half—fringe photoelastic technique combined with digital image analysis was used to determine the stress intensity factors under thermal shock for a crack very near and parallel to the edge of a plate. The experimental results for the time-dependent SIF were presented.