摘要
本文基于化学气相沉积(CVD)金刚石膜的超高热导率,设计并搭建了一套实验系统,分析其对于小空间高热流密度电子元件的散热效果。通过测量加热器及材料表面的温度值可知,相同工况下,金刚石膜温度梯度小,温度分布均匀性好,表面最大温差仅为铜的一半且加热面温度相比于铜更低。实验结果说明CVD金刚石膜的散热性能明显优于传统散热材料铜。实验验证了经过Ti-Ni-Au金属化处理的CVD金刚石薄膜具有可焊性。在实验基础上,利用Flotherm软件对系统进行仿真建模,进一步探讨了材料厚度、热导率及接触热阻对加热面温度和最大热流密度的影响。
Based on ultrahigh thermal conductivity of chemical vapor deposition（CVD） diamond film,a set of experimental system was designed and built in order to analyze its heat dissipation performance for small room and high heat flux electronic components.By measuring the surface temperature of heater and material at the same condition,the authors found that the diamond film had smaller temperature gradient,better uniformity of temperature distribution,and its maximum temperature difference was only 50% that of copper.The experimental results showed that CVD diamond film had better heat dissipation performance than copper.The weldability of CVD diamond film was verified experimentally through the metallization of diamond surface with Ti-Ni-Au.Based on the experiments,the influences of the material thickness,thermal conductivity and contact resistance to the heater surface temperature and the maximum heat flux was further discussed with the simulation model built using Flotherm software.
出处
《金刚石与磨料磨具工程》
CAS
北大核心
2010年第3期22-27,共6页
Diamond & Abrasives Engineering
基金
该项目属于"十一五"装备预先研究项目计划
关键词
CVD金刚石膜
散热
热导率
接触热阻
CVD diamond film
heat dissipation
thermal conductivity
contact resistance
