摘要
阐述了充氮包装原理,研制了充氮包装设备与材料,并进行了以氧浓度为判据的充氮包装工艺研究。结果表明:充氮包装技术最佳工艺参数为氮气纯度为99.5%,真空度为95 kPa,充氮压力约为0.10 MPa,热合温度为140℃;充氮包装技术为军用光电器材储存营造了一个良好的"微环境",可实现军用光电器材的优质包装。
Based on the introduction of the principle of nitrogen-filled packaging technology,the development of Nitrogen-filled packing equipments and materials,and the research of Nitrogen-filled packing process regarded Oxygen concentration as its criterion,here comes the conclusion that,the best process parameters for Nitrogen-filled packing technology shall be 99.5% of Nitrogen concentration,95 kPa of vacuum degree,0.10 MPa of Nitrogen-filled pressure and 140 ℃ of heat-seal temperature;meanwhile,Nitrogen-filled packing technology has provided an excellent ＂micro-environment＂ for the storage of military optoelectronic equipments so as to realize the manufacture of the best packing for military optoelectronic equipments.
出处
《包装工程》
CAS
CSCD
北大核心
2010年第13期63-65,共3页
Packaging Engineering
关键词
包装
军用器材
综合防护
military packaging
military equipment
synthesis protection
