以Ag-Cu合金触点废料制备超细铜粉和银粉

Preparation of Superfine Copper and Silver Powders from Waste Ag-Cu Alloy Contact

以Ag-Cu合金废触点制备CuCl2和AgCl,采用葡萄糖预还原-水合肼二次还原法制备超细铜粉、氨-肼还原法制备超细银粉。结果表明:在反应温度为70℃,加入适量PVP和苯并三氮唑作为分散剂和抗氧化剂的条件下,所得微米级铜粉的粒度在0.3～0.6μm,粒度分布范围小,纯度高于99.9%。经3个月的抗氧化试验表明,所得铜粉产品的抗氧化性能较高。一定时间的球磨是氨-肼还原法制备超细银粉的关键,经24h湿法球磨后干燥所得银粉的粒度为1.90μm,分布均匀。

CuC12 and AgCl were prepared using waste Ag-Cu alloy contact as copper and silver origin source. CuC12 was reduced by glucose first and then hydrazine hydrate to prepare superfine copper powders, while AgCl was reduced by hydrazine hydrate in ammonia solution and then be treated with ball milling for a certain time. It is shown that the product of copper powders are single crystals with the size of 0.3-0.6 μm and its purity is higher than 99.9% with proper amount of PVP and benzotriazole at 70 ℃. The anti-oxidation results in 3 months show that the obtained Cu powders are stable in air. Wet ball milling is the key step during preparation of Ag powders by reduction method with hydrazine hydrate in ammonia, and the particle size of Ag powders after 24 h ball milling is 1.90 μm and homogeneous.