摘要
在电路板贴片安装生产过程中,进行多环节质量检测和控制可以大大降低返修成本、提高产品的合格率。文章讨论了贴片生产线多个不同生产环节的各种质量缺陷、自动检测技术和统计过程控制,比较了焊膏检测、自动光学检测、在线检测和功能检测及X射线检测等各种检测技术,分析了多环节质量检测和控制策略。
The manufacturing cost of SMT products is high ,and its repairs difficultly ,so it need to solve quality problems in the assembly process ,avoiding product repair and scrap.The requirement of real-time is given to the quality inspection and control of SMT products.Setting quality inspections after each procedure becomes necessary measures of quality control.This paper lists possible quality defects of part processes in the assembly process and their AOI detection methods.The article also enumerates possible quality defects after PCB soldering and the corresponding method of detection.
出处
《电子质量》
2010年第7期51-54,共4页
Electronics Quality
