摘要
市场的需求推动了系统集成在功率电子行业中的发展。本文将IGBT模块集成精确的电阻取样(如英飞凌MIPAQ^(TM)系列)与IGBT片上电流检测功能进行比较。同时对通过采用DBC上集成的NTC热敏电阻测量方法和通过IGBT片上集成的温度检测二极管测量方法进行了比较。接下来,在模块内部还采用∑-△转换器和无磁芯变压器技术对取样的信号进行转换和隔离传输。
System integration is one of the market driving issues in power electronics.In this paper the integration of precise shunts into IGBT modules,like it is done in Infineons MIPAQ^(?) family,is compared to on-IGBT-chip current sense functionality.Temperature measurement via NTC-resistor on DBC-level or on-IGBT-chip integrated temp-sense-diodes will be treated as well.Further processing of the low voltage sense signals is done by sigma-delta converter including a functional isolation barrier by Coreless Transformer Technology(CLT).
出处
《变频器世界》
2010年第7期83-87,114,共6页
The World of Inverters