焊锡珠产生原因及改进方法

Root Cause Analysis and Improvement to Solder Ball

表面组装技术在现代电子装配中已经成为主流,但在实际的规模生产过程中,还是有各种各样的问题发生,焊锡珠是最主要的缺陷。采用鱼骨图的分析方法,从人员、机器、物料、方法、环境五个方面入手,研究改进措施,通过保证焊膏质量、优化模板、防止印刷塌陷、调整贴片压力、消除印制板污染、控制温湿度,将焊锡珠缺陷降低到可接受的范围,达到质量的期望值。

SMT is developed in modem electronics assembly manufacturing, but defects are still suffering products quality, especially for solder ball. Fish bone analyzing tool is used to dig out the root cause, covering man, machine, material, method and environment. To achieve quality expectation, it is important and effective by controlling printing, placement and reflow parameters, optimizing stencil design, eliminating pollution of PCB, meeting temperature and humidity requirement, etc.