MOSFET器件引线键合技术

MOSFET Devices Wire Bonding Technology

MOSFET器件由于高阻抗、低功耗等特点,在电脑电源、家用电器和自动控制系统等方面得到广泛应用。但由于其芯片结构的特殊性,在封装制造过程中容易受到静电、应力、环境条件等多种因素的影响。引线键合过程是影响封装成品率的关键工艺环节。引线键合是电子工程互连的重要方式,MOSFET器件通常采用超声键合的工艺进行引线互连。影响引线键合质量的因素较多,其中引线键合工艺、引线材料和设备维护是最重要的三个因素。通过实际生产过程的试验、分析和提炼,研究引线键合技术,总结了引线键合工艺、引线材料和设备维护三个方面的实践经验,为提升和稳定封装成品率提供参考。

MOSFET devices are widely used in the computer power supply,household appliances and automatic control system,etc.due to high impedance,low power consumption characteristics;But because of its chip architecture are unique,in the manufacturing process,vulnerable to static electricity,stress,environmental conditions and other factors.The wire bonding process is a key technology process,which affect assembly yield.Wire bonding is an important way in the interconnection of electronic engineering,and MOSFET devices are commonly used ultrasonic bonding to implement interconnection.There are many factors which affect the quality of wire bonding,in which wire bonding technology,wire materials,and equipment maintenance is the most important three factors.By means of the experiment,analysis,and refining in actual production process,study wire bonding technology and summed up the practice experience about the wire bonding technology,wire materials,and equipment maintenance,and provide a reference to improve and stability assembly yield.