Ar^+及沉积气压对离子溅射制备铜钨复合膜结构的影响

Influence of Ar^+ion and deposition air pressure on microstructure of ion-beam sputtered copper-tungsten complex film

研究双离子束溅射组装铜钨复合膜Ar+能量及束流对膜影响。用XRD分析溅射沉积后的薄膜结构。实验结果表明,随靶Ar+能量和束流增加,铜钨膜向晶态化转变。铜钨复合膜的沉积速率主要由钨靶Ar+束流决定,并且增加气压会使复合膜晶粒尺寸变小,固溶进钨的铜原子也会相应减少。

The influence of Ar^＋ energy and ion beam on copper-tungsten film by double-ion-beam sputtering was studied.The microstructure of sputtered film was also studied by XRD.The results show that with the target Ar^＋ energy and ion beam flux increasing,copper-tungsten film is transformed into crystallization.The deposition rate of copper-tungsten complex film is mainly determined by tungsten target Ar^＋ ion beam flux and the increase of air pressure makes grain size become smaller,the solid solution of the copper atoms into tungsten is also decreased.