摘要
研究双离子束溅射组装铜钨复合膜Ar+能量及束流对膜影响。用XRD分析溅射沉积后的薄膜结构。实验结果表明,随靶Ar+能量和束流增加,铜钨膜向晶态化转变。铜钨复合膜的沉积速率主要由钨靶Ar+束流决定,并且增加气压会使复合膜晶粒尺寸变小,固溶进钨的铜原子也会相应减少。
The influence of Ar^+ energy and ion beam on copper-tungsten film by double-ion-beam sputtering was studied.The microstructure of sputtered film was also studied by XRD.The results show that with the target Ar^+ energy and ion beam flux increasing,copper-tungsten film is transformed into crystallization.The deposition rate of copper-tungsten complex film is mainly determined by tungsten target Ar^+ ion beam flux and the increase of air pressure makes grain size become smaller,the solid solution of the copper atoms into tungsten is also decreased.
出处
《兵器材料科学与工程》
CAS
CSCD
2010年第4期76-78,共3页
Ordnance Material Science and Engineering
基金
江西省教育厅科技计划项目(GJJ10206)
关键词
铜钨薄膜
离子束溅射
Ar+能量
束流
晶粒度
Cu-W thin film
ion beam sputtering
Ar^+ energy
beam flux
grain size