Cu-Ni-Si-P合金动态再结晶行为

Dynamic recrystallization behavior of Cu-Ni-Si-P alloy

利用Gleeble-1500D热模拟试验机,采用高温等温压缩试验,对Cu-2.0Ni-0.5Si-0.03P合金在应变速率为0.01～5 s-1、变形温度为600～800℃、最大变形程度为60%条件下的动态再结晶行为以及组织转变进行了研究。利用加工硬化率和应变(θ-ε)的关系曲线确定了该合金发生动态再结晶的形变条件为T≥700℃。根据σ-ε曲线确定了不同变形条件下该合金的动态再结晶的体积分数,利用该体积分数建立了该合金的动态再结晶动力学数学模型。该合金动态再结晶的显微组织受变形速率的影响,在变形速率较低时,晶体内有较多的再结晶晶粒;而在较高应变速率下,合金几乎没有发生动态再结晶。

The dynamic recrystallization behavior and microstructure evolution of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression were studied by isothermal compression test at a Gleeble-1500D thermal-mechanical simulator at 600-800 ℃ with the strain rates from 0.01 s-1to 5 s-1 under the maxium strain of 60%.The condition of dynamic recrystallization was T≥700 ℃ determined by using the working hardening rate-strain curves.The recrystallized fraction at various deformation conditions was measured by using σ-ε curve and the dynamic recrystallization kinetic equation was obtained by using the recrystallized fraction of the alloy.The microstructure depended on the strain rates,and recrystallized grains were observed in the alloy under lower strain rates.The dynamic recrystallization was not to occur under higher strain rates.