摘要
本文叙述了世界微电子技术和集成电路的芯片工艺、设计及封装技术 ,对今后可能出现或将成为主流产品的微电子器件作了分析与展望。
Microelectronic technology and the IC chip processes,design,package technology in the world is discussed.Analyz and prospect on the future main microelectronic device is given.At last,the anticle simply analyze the microelectronic technology and IC development policy in China.
出处
《微处理机》
1999年第1期1-7,共7页
Microprocessors