热等静压对电子封装60wt%Si-Al合金组织与性能的影响

Effects of HIP on microstructures and properties of 60wt%Si-Al electronic packaging materials

采用喷射成形技术制备了新型电子封装材料60wt%Si-Al合金,选用两种热等静压工艺对其进行致密化处理,研究热等静压对材料组织和性能的影响。观察、分析了热等静压致密化后合金组织,测试了热等静压后合金的致密度、导热及热膨胀性能。结果表明,热等静压可有效减少或消除喷射成形60wt%Si-Al合金坯件内部的缩松缩孔,使合金接近理论密度。固态(520℃)热等静压后的合金相比半固态(600℃)热等静压合金,表现出更高的致密度、热导率和更低的热膨胀系数。

A novel 60wt%Si-Al alloy packaging material for electronic applications was prepared by spray forming technology.Two hot isostatic pressing （HIP） processes were applied to investigate the effect on microstructures and properties of 60wt%Si-Al alloy.The microstructures after HIP were observed with SEM.Relative density,thermal conductivity and thermal expansion properties of 60wt%Si-Al alloy after HIP were tested.The results show that by HIP microporosity in preforms can be partly or completely eliminated and the relative density can be increased.The alloy after HIP at 520℃ has higher relative density,higher thermal conductivity and lower coefficient of thermal expansion（CTE） than at 600℃.