聚氨酯泡沫塑料化学镀铜液的稳定效果和沉铜速度的研究

STUDY OF STABILITY AND SEDIMENTATIONRATE OF ELECTROLESS COPPER PLATING SOLUTIONFOR METALLIZING POLYURETHANE FOAM

本文对聚氨酯泡沫金属化的化学镀铜液的稳定性进行探索．试验研究化学镀液的成分及工艺条件对化学镀铜液稳定性和沉铜速度的影响．通过正交实验确定了化学镀铜液的配方及工艺规范．

The stability of electroless copper plating solution for metallizing polyurethane foam has been studied. The effects of the components of the solution and the technological conditions on the stability and the sedimentation rate have been analyzed by experiments. The optimal prescription for the solution and the technological regulation for electroless Cu plating on polyurethane foam have been got by mean of orthogonal experiments.