摘要
将特种加工的快速成开中熔融沉积加工装备微型化,结合机械制造的成组工艺,即半导体加工的阵列技术应用于微模具加工,批量制造微模具工程可以实现,提出了另一种半导体加工工艺技术,运用于微模具CAD/CAM/CAE,这种加工工艺效率高,精度主和速度快。
The rapid formation of special processing of fused deposition processing device miniaturization, combined with mechanical manufacturing group technology, that is used in semiconductor processing, micro-array technology mold, micro-mold construction volume manufacturing can be achieved, proposed another semiconductor processing technology, used in micro-mold CAD / CAM / CAE, this processing technology, high efficiency, high accuracy and speed.
出处
《模具工程》
2010年第8期86-86,73,共2页
Mould &Die Project