摘要
由于PBGA组件点位于四件与PCB之间,焊点的检查和检修成本很高,控制PCB组件焊接失效显得尤为重要。文章通过对焊接失效的焊盘镍层、金层结构进行了SEM、X-RAY分析导致焊接失效产生的主要原因,并针对此现象进行控制与改善。
Because PBGA module is located between four parts components and PCB, the solder joints check and repair cost is high, therefore the control of PCB assembly welding failure appears particularly important. Based on the failure of welding plate nickel layer, gold layer structure SEM, X-RAY in welding failure analysis of the main reasons for this phenomenon, the author proposed improvement and control method.
出处
《印制电路信息》
2010年第8期63-66,共4页
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