摘要
高密度电子组装技术是实现机载、舰载和星载等电子装备向小型化、轻量化、高性能和高可靠方向发展的有效途径。文中通过对高密度组装技术在信号处理机上的应用研究分析,叙述了板级电路高密度组装技术的概念、研究内容和关键技术,明确指出可制造性设计、高精度印刷、贴装以及优化的焊接温度曲线的设置是板级电路高密度组装技术的有效手段。研究成果已成功地应用在雷达信号处理机、接收/发射组件等分系统中。
The high density electronic packaging technology is excellent methods for realizing miniature volume, light weight, high performance and reliability of air-borne ,ship-borne and satellite-borne electronic equipments, In this paper, Application of high density assembly on radar signal process equipment was investigated,the concept,content to study and the key technology were paticulaarly described. The results show that the technology of design for manufacturability（DFM）,exactly solder printing and placement, optimized profile can greatly improve the quality of high density PCA. The technology has been applied successfully in signal processor of Radar and transmit/receive module.
出处
《现代雷达》
CSCD
北大核心
2010年第7期67-69,共3页
Modern Radar
关键词
高密度组装
高密度器件
可制造性设计
high density assembly
high density devices
design for manufacturability
