摘要
近年来各种含硅聚酰亚胺相继开发.它既保持了聚酰亚胺优良的耐热及电气性能,又具有有机硅的溶解性、良好的粘接性及低吸湿性.其主要用于微电子工业、宇航及印刷线路工业等.本文侧重介绍聚硅氧烷——聚酰亚胺嵌段共聚物.
In recent years, various kinds of silicon containing polyimides have been developed in succession, which maintained some of the excellent properties of polyimide e.g. thermal and electrical properties, and some of the desirable properties of silicon. These polymers can be applied in advanced technical industries of micro - electronics, aerospace, and printed circuit. The author has laid his emphasis of recommendation on the review of polysiloxane -block - polyimides copolymers.
出处
《上海化工》
CAS
1999年第11期28-30,17,共4页
Shanghai Chemical Industry
