一种新型合金材料石墨铝的应用前景

Application Prospect of a New Alloy Material Graphite Aluminum

介绍一种新型合金材料石墨铝,与传统封装材料进行了比较,表明该材料同时兼有低密度(2.46 g/cm3)、高热导率(200 W/m.K)、与半导体器件热膨胀系数(7×10-6和4×10-6/K)匹配和易加工的特性,且热膨胀系数可以根据需要定制。指出该材料是一种适合大功率器件或单片装配的理想匹配材料,比钨铜、钼铜、可伐等常用材料的密度小几倍,甚至比Al材料密度还低10%。研究表明该种材料的应用可以简化装配程序,降低工艺难度,减轻盒体重量;随着材料生产成本的降低,应用前景广阔。目前国外已经开始在航天、舰船、电子对抗等产品中使用,甚至已经开始应用于汽车领域,应用前景广阔。

A new alloy material graphite aluminum is introduced.Compared with conventional encapsulation materials,it is proved great advantages of low density（2.46 g/cm3）,high thermal conductance（200 W/m·K）,good thermal expansion coefficient（TEC） matching（7×10-6 and 4 ×10-6/K） between semiconductor chips and graphite aluminum,and easy processing.The TEC can be custom-tailored to fit different requirements.The density of the material is several times lower than tungsten copper,molybdenum copper,kovar,and even 10% lower than aluminum.It is demonstrated an ideal matching material for high power devices and monolithic assembly.The application of the material can simplify assembly procedures,decrease processing difficulties,and reduce package weight.Graphite aluminum is widely used in aerospace,marine,electronic countermeasure,and automotive products in abroad and will have bright application prospect along with the reduction of the material cost.