摘要
与其他半导体器件相比,CMOS集成电路具有功耗小、噪声容限大等优点,对于对重量、体积、能源消耗都有严格要求的卫星和宇宙飞船来说,CMOS集成电路是优先选择的器件种类。随着半导体器件的等比例缩小,辐射效应对器件的影响也在跟着变化。这些影响包括:栅氧化层厚度、栅长的减小、横向非均匀损伤、栅感应漏电流等方面。对于微电子器件的抗辐射加固,文章就微电子器件的应用场合、辐射环境的辐射因素和强度等,从微电子器件的制作材料、电路设计、器件结构、工艺等多方面进行加固考虑,针对各种应用环境提出加固方案。
To contrast with other device,CMOS has advantages on less power,noise martin.To satellites and spaceship are concerned,CMOS is the first choice.The radiation effect for semiconductor scaling was described.It is included:thickness of oxide of gate,scaling of gate,GIDL.Then,the radiation hardened of devices was introduced,in detail.For difference application,we give the difference ways to hardened.
出处
《电子与封装》
2010年第8期31-36,共6页
Electronics & Packaging